Product Name: Alumina Ceramic Substrate
Product Material: High-purity Aluminum Oxide (Al₂O₃ 96%-99.6%)
Material Characteristics: High insulation, high temperature resistance, high mechanical strength, excellent thermal stability, good thermal conductivity
Application Fields: Electronic component packaging, sensor supports, circuit substrates, heater substrates, vacuum equipment
Application Industries: Semiconductor manufacturing, electronics and electrical, aerospace, medical devices, new energy
Processing Challenges: Multi-aperture precision control, high flatness requirements, thin-wall structural strength, metallization bonding strength
Processing Flow: Powder processing → Spray granulation → Dry pressing/Injection molding → High-temperature sintering → Precision machining → Metallization → Inspection and packaging
Delivery Time: 25-35 days for standard specifications, 40-55 days for complex structures
Key Features：
Exceptional Electrical Insulation
High volume resistivity (>10¹⁴ Ω·cm) and dielectric strength (>15 kV/mm) ensure reliable electrical isolation in high-voltage applications
Excellent Thermal Stability
Withstands continuous operation at temperatures up to 1500°C while maintaining structural integrity and electrical properties
Superior Mechanical Strength
High compressive strength (2200 MPa) and flexural strength (320 MPa) provide reliable support for mounted components
Good Thermal Conductivity
Thermal conductivity (20-30 W/mK) enables efficient heat dissipation from sensitive electronic components
Outstanding Chemical Resistance
Resists corrosion from most chemicals and solvents, ensuring long-term reliability in harsh environments
Precision Manufacturing
Tight dimensional control (±0.05 mm) and excellent surface finish (Ra < 0.4 μm) ensure perfect component mounting and alignment
