Product Name: Ceramic Trays
Product Material: Aluminum Nitride (AlN)/Alumina (Al₂O₃)/Silicon Carbide (SiC)
Material Characteristics: High thermal conductivity, excellent thermal shock resistance, high temperature stability, chemical corrosion resistance, high mechanical strength
Application Fields: Semiconductor wafer processing, LED epitaxial growth, photovoltaic cell manufacturing, chemical corrosion environments, high-temperature heat treatment
Application Industries: Semiconductor manufacturing, LED and display, solar energy, chemical processing, aerospace
Processing Challenges: Large-size flatness control, thin-wall structure strength, high-temperature deformation prevention, surface contamination control
Processing Flow: Powder preparation → Forming → High-temperature sintering → Precision machining → Surface treatment → Quality inspection → Packaging
Delivery Time: 30-40 days, 45-60 days for customized specifications
Ceramic Trays are precision-engineered components specifically designed for applications requiring exceptional thermal management performance, reliable operation in extreme temperature environments, and outstanding thermal shock resistance. Manufactured from advanced ceramic materials including aluminum nitride, alumina and silicon carbide, these trays deliver superior performance in high-temperature processing applications, outperforming traditional materials through their excellent thermal conductivity, thermal stability, and mechanical reliability.
Key Features:
Exceptional Thermal Conductivity - High thermal conductivity (AlN: 170-200 W/mK, SiC: 120-170 W/mK) provides outstanding heat transfer performance, ensuring uniform temperature distribution across the tray surface and significantly improving process consistency in thermal processing applications.
Excellent Thermal Shock Resistance - Withstands rapid temperature changes exceeding 800°C without cracking or deformation, maintaining structural integrity in applications involving frequent thermal cycling between room temperature and high processing temperatures.
Superior High Temperature Stability - Withstands continuous operation at temperatures up to 1600°C while maintaining excellent mechanical properties and dimensional stability, suitable for extreme temperature environments in semiconductor and materials processing.
Outstanding Chemical Resistance - Highly resistant to most acids, alkalis and corrosive gases, ensuring long-term performance stability in aggressive chemical environments and preventing contamination from tray material degradation.
High Mechanical Strength - High flexural strength (300-400 MPa) and compressive strength (2000-2500 MPa) ensure reliable structural performance under heavy loading conditions and thermal stresses in industrial processing applications.
Precision Dimensional Control - Maintains tight tolerances (±0.05 mm) on critical dimensions and superior surface flatness (<20 μm/in), ensuring perfect wafer placement and reliable performance in precision manufacturing processes.
